Unit 1: Introduction to MEMS
8 hrsMEMS Fabrication Technologies, Materials and Substrates for MEMS, Processes for Micromachining, Characteristics, Sensors/Transducers, Piezoresistance Effect, Piezoelectricity, Piezoresistive Sensor.
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MEMS Fabrication Technologies, Materials and Substrates for MEMS, Processes for Micromachining, Characteristics, Sensors/Transducers, Piezoresistance Effect, Piezoelectricity, Piezoresistive Sensor.
Stress and Strain, Hooke's Law. Stress and Strain of Beam Structures: Stress, Strain in a Bent Beam, Bending Moment and the Moment of Inertia, Displacement of Beam Structures Under Weight, Bending of Cantilever Beam Under Weight.
Drag Effect of a Fluid: Viscosity of a Fluid, Viscous Flow of a Fluid, Drag Force Damping, The Effects of Air Damping on Micro-Dynamics. Squeeze-film Air Damping: Reynolds' Equations for Squeeze-film Air Damping, Damping of Perforated Thick Plates. Slide-film Air Damping: Basic Equations for Slide-film Air Damping, Couette-flow Model, Stokes-flow Model.
Electrostatic Forces, Normal Force, Tangential Force, Fringe Effects, Electrostatic Driving of Mechanical Actuators: Parallel-plate Actuator, Capacitive sensors. Step and Alternative Voltage Driving: Step Voltage Driving, Negative Spring Effect and Vibration Frequency.
Temperature coefficient of resistance, Thermo-electricity, Thermocouples, Thermal and temperature sensors. Applications of MEMS in RF MEMS Resonator Design Considerations, One-Port Micromechanical Resonator Modeling Vertical Displacement Two-Port Microresonator Modeling, Micromechanical Resonator Limitations.
After completion of the course student will be able to:
This subject is on page 6 of the original AKTU PDF.