Unit 1: Miniaturization
8 hrsIntroduction, Need of miniaturization, Microsystems versus MEMS, Need of micro fabrication, smart materials, structures and systems, integrated Microsystems, applications of smart materials and Microsystems.
B.Tech Electronics & Instrumentation / Instrumentation & Control · Sem 7 (Departmental Elective-IV)
Introduction, Need of miniaturization, Microsystems versus MEMS, Need of micro fabrication, smart materials, structures and systems, integrated Microsystems, applications of smart materials and Microsystems.
Silicon capacitive accelerometer, piezo-resistive pressure sensor, conductometric gas sensor, an electrostatic combo -drive, a magnetic micro-relay, portable blood analyzer, piezoelectric inkjet print head, micro-mirror array for video projection, smart materials and systems.
Silicon as a material for micro machining, thin film deposition, lithography, etching, silicon micromachining, specialized materials for Microsystems, advanced processes for micro fabrication.
Bar, beam, energy methods for elastic bodies, heterogeneous layered beams, bimorph effect, residual stress and stress gradients, poisson effect and the anticlastic curvature of beams, torsion of beams and shear stresses, dealing with large displacements, In-plane stresses. Modeling of coupled electromechanical systems: Electrostatics, Coupled Electro-mechanics: statics, stability and pull-in phenomenon, dynamics, Squeezed film effects in electro-mechanics.
Integration of Microsystems and microelectronics, microsystems packaging, case studies of integrated Microsystems, case study of a smart-structure in vibration control. Scaling effects in Microsystems: scaling in: mechanical domain, electrostatic domain, magnetic domain, diffusion, effects in the optical domain, biochemical phenomena.
After completion of the course student will be able to:
This subject is on page 10 of the original AKTU PDF.